Items where Author is "Amalu, Emeka H"

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Conference or Workshop Item

Depiver, Joshua A, Mallik, Sabuj and Amalu, Emeka H (2024) Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules. In: 40th International Electronics Manufacturing Technology (IEMT), October 2024, Malaysia.

This list was generated on Fri Apr 4 02:02:49 2025 BST.