Items where Author is "Depiver, Joshua A."

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Article

Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714

Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2023) Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging. Journal of Electronic Materials, 52 (7). pp. 4655-4671. ISSN 0361-5235

Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2021) Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Engineering Failure Analysis, 125. p. 105447. ISSN 13506307

This list was generated on Sat Apr 5 02:02:13 2025 BST.