Items where Author is "Ekere, Ndy"
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Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias and Ogbodo, Eugene A. (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials, 52 (6). pp. 3786-3796. ISSN 0361-5235