Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.
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Access this via: https://doi.org/10.1109/ISSE61612.2024.10604180
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Keywords: | Solder, Interconnects, Finite Element Analysis (FEA) |
| Depositing User: | RED Unit Admin |
| Date Deposited: | 31 Jul 2024 07:50 |
| Last Modified: | 31 Jul 2024 07:50 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19124 |
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