Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.
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Access this via: https://doi.org/10.1109/ISSE61612.2024.10604180
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Keywords: | Solder, Interconnects, Finite Element Analysis (FEA) |
| Divisions: | College of Creative Arts, Technology and Engineering > Engineering |
| Depositing User: | Research and Knowledge Exchange Office Admin 1 |
| Date Deposited: | 31 Jul 2024 07:50 |
| Last Modified: | 16 Jun 2026 10:01 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19124 |
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