Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules
Depiver, Joshua A, Mallik, Sabuj and Amalu, Emeka H. (2024) Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules. In: 40th International Electronics Manufacturing Technology (IEMT), October 2024, Malaysia.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Additional Information: | ** From Crossref proceedings articles via Jisc Publications Router ** History: ppub 16-10-2024; issued 16-10-2024. |
| SWORD Depositor: | JISC Router |
| Depositing User: | JISC Router |
| Date Deposited: | 27 Mar 2025 12:13 |
| Last Modified: | 11 Jun 2025 12:41 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19651 |
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