Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2023) Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging. Journal of Electronic Materials, 52 (7). pp. 4655-4671. ISSN 0361-5235
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Access this via: https://doi.org/10.1007/s11664-023-10394-x
| Item Type: | Article |
|---|---|
| Depositing User: | RED Unit Admin |
| Date Deposited: | 11 Mar 2025 13:31 |
| Last Modified: | 11 Mar 2025 13:31 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19665 |
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