Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors
Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias and Ogbodo, Eugene A. (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials, 52 (6). pp. 3786-3796. ISSN 0361-5235
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Access this via: https://doi.org/10.1007/s11664-023-10340-x
| Item Type: | Article |
|---|---|
| Depositing User: | RED Unit Admin |
| Date Deposited: | 11 Mar 2025 13:32 |
| Last Modified: | 11 Mar 2025 13:32 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19666 |
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