Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2021) Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Engineering Failure Analysis, 125. p. 105447. ISSN 13506307
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Access this via: https://doi.org/10.1016/j.engfailanal.2021.105447
| Item Type: | Article |
|---|---|
| Depositing User: | RED Unit Admin |
| Date Deposited: | 11 Mar 2025 13:28 |
| Last Modified: | 11 Mar 2025 13:28 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/19668 |
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