Advancing Reliability in Electronic Packaging: Navigating the Shift from Lead to Lead-Free Soldering.

Mallik, Sabuj (2024) Advancing Reliability in Electronic Packaging: Navigating the Shift from Lead to Lead-Free Soldering. [Video]

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Abstract

This lecture is about the impact that transitioning from lead based to lead-free solders exhibits on the reliability of electronic products. Through illustrative examples Sabuj will offer valuable insights into how his research has aided electronic manufacturing industries in overcoming the hurdles associated with adopting new solder materials. The presentation will explore several research studies which have investigated the reliability of electronics packaging, with particular emphasis on lead-free solder joints. The lecture will also demonstrate how a multitude of experimental and simulation-based research endeavours have contributed to comprehending, characterising, and predicting solder joint behaviours under demanding operational circumstances.

Item Type:	Video
Depositing User:	RED Unit Admin
Date Deposited:	12 Sep 2025 13:46
Last Modified:	12 Sep 2025 13:46
URI:	https://bnu.repository.guildhe.ac.uk/id/eprint/20633

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