Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects
Depiver, Joshua Adeniyi and Mallik, Sabuj (2025) Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects. In: 2025 International Conference on Modeling, Simulation and Intelligent Computing (MoSICom). 2025 International Conference on Modeling, Simulation and Intelligent Computing (MoSICom) . IEEE, pp. 359-364. ISBN 979-8-3315-7391-1
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Access this via: https://doi.org/10.1109/MoSICom67153.2025.11398281
| Item Type: | Book Section |
|---|---|
| Depositing User: | Research and Knowledge Exchange Office Admin 1 |
| Date Deposited: | 26 Mar 2026 12:08 |
| Last Modified: | 26 Mar 2026 12:08 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/20917 |
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