Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects

Depiver, Joshua Adeniyi and Mallik, Sabuj (2025) Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects. In: 2025 International Conference on Modeling, Simulation & Intelligent Computing (MoSICom), 10th to 12th December 2025, Dubai, United Arab Emirates.

Full text not available from this repository. (Request a copy)

Access this via: https://doi.org/10.1109/MoSICom67153.2025.11398281

Item Type:	Conference or Workshop Item (Paper)
Depositing User:	Research and Knowledge Exchange Office Admin 1
Date Deposited:	26 Mar 2026 12:08
Last Modified:	14 May 2026 12:38
URI:	https://bnu.repository.guildhe.ac.uk/id/eprint/20917

Actions (login required)

Edit Item