Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects
Depiver, Joshua Adeniyi and Mallik, Sabuj (2025) Hybrid Predictive Model for Thermo-Mechanical Reliability Assessment of Lead-Free Solder Interconnects. In: 2025 International Conference on Modeling, Simulation; Intelligent Computing (MoSICom), 10th to 12th December 2025, Dubai, United Arab Emirates.
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20917_Mallik.pdf - Accepted Version Available under License Creative Commons Attribution. Download (820kB) |
Access this via: https://doi.org/10.1109/MoSICom67153.2025.11398281
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Divisions: | College of Creative Arts, Technology and Engineering > Engineering |
| Depositing User: | Research and Knowledge Exchange Office Admin 1 |
| Date Deposited: | 26 Mar 2026 12:08 |
| Last Modified: | 16 Jun 2026 09:07 |
| URI: | https://bnu.repository.guildhe.ac.uk/id/eprint/20917 |
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