Items where Author is "Amalu, Emeka H."
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Number of items: 2.
Article
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714
Conference or Workshop Item
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.