Items where Author is "Amalu, Emeka H."
Up a levelArticle
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2025) Finite Element Comparative Study on Creep and Random Vibrations of Solder Joints in BGA Package. Power Electronic Devices and Components. p. 100085. ISSN 27723704
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2023) Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging. Journal of Electronic Materials, 52 (7). pp. 4655-4671. ISSN 0361-5235
Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias and Ogbodo, Eugene A. (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials, 52 (6). pp. 3786-3796. ISSN 0361-5235
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2021) Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Engineering Failure Analysis, 125. p. 105447. ISSN 13506307
Conference or Workshop Item
Depiver, Joshua A, Mallik, Sabuj and Amalu, Emeka H. (2024) Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules. In: 40th International Electronics Manufacturing Technology (IEMT), October 2024, Malaysia.
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.
