Items where Author is "Depiver, Joshua"
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Number of items: 2.
Article
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2025) Finite Element Comparative Study on Creep and Random Vibrations of Solder Joints in BGA Package. Power Electronic Devices and Components. p. 100085. ISSN 27723704
Conference or Workshop Item
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.