Items where Author is "Ekpu, Mathias"
 | Up a level |
Group by: Item Type | No Grouping
Number of items: 1.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244.