Items where Author is "Ekpu, Mathias"

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Article

Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias and Ogbodo, Eugene A. (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials, 52 (6). pp. 3786-3796. ISSN 0361-5235

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244.

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