Items where Author is "Ekpu, Mathias"

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Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244.

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