Items where Division is "College of Creative Arts, Technology and Engineering > Archiecture, Building and Planning" and Year is 2024
Up a levelNumber of items: 3.
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.
Mallik, Sabuj (2024) Advancing Reliability in Electronic Packaging: Navigating the Shift from Lead to Lead-Free Soldering.