Items where Author is "Mallik, Sabuj"
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Article
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714
Bernasko, Peter K and Mallik, Sabuj (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58.
mathias, Ekpu, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). pp. 159-166.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244.
Conference or Workshop Item
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.