Items where Author is "Mallik, Sabuj"
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Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2025) Finite Element Comparative Study on Creep and Random Vibrations of Solder Joints in BGA Package. Power Electronic Devices and Components. p. 100085. ISSN 27723704
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2024) Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package. Microelectronics Reliability, 157. p. 115415. ISSN 0026-2714
Odiyi, D.C., Sharif, T., Choudhry, R.S., Mallik, Sabuj and Shah, S.Z.H. (2023) A review of advancements in synthesis, manufacturing and properties of environment friendly biobased Polyfurfuryl Alcohol Resin and its Composites. Composites Part B: Engineering, 267. p. 111034. ISSN 13598368
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2023) Characterising Solder Materials from Random Vibration Response of Their Interconnects in BGA Packaging. Journal of Electronic Materials, 52 (7). pp. 4655-4671. ISSN 0361-5235
Njoku, Jude E., Amalu, Emeka H., Ekere, Ndy, Mallik, Sabuj, Ekpu, Mathias and Ogbodo, Eugene A. (2023) Effects of Reflow Profile and Miniaturisation on the Integrity of Solder Joints in Surface Mount Chip Resistors. Journal of Electronic Materials, 52 (6). pp. 3786-3796. ISSN 0361-5235
Odiyi, D.C., Sharif, T., Choudhry, R.S. and Mallik, Sabuj (2021) Cure mechanism and kinetic prediction of biobased glass/polyfurfuryl alcohol prepreg by model-free kinetics. Thermochimica Acta, 708. p. 179133. ISSN 00406031
Depiver, Joshua A., Mallik, Sabuj and Amalu, Emeka H. (2021) Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions. Engineering Failure Analysis, 125. p. 105447. ISSN 13506307
Bernasko, Peter K and Mallik, Sabuj (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58.
mathias, Ekpu, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). pp. 159-166.
Ekpu, Mathias, Bhatti, Raj, Okereke, Michael, Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). pp. 239-244.
Conference or Workshop Item
Depiver, Joshua A, Mallik, Sabuj and Amalu, Emeka H (2024) Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules. In: 40th International Electronics Manufacturing Technology (IEMT), October 2024, Malaysia.
Depiver, Joshua, Mallik, Sabuj and Amalu, Emeka H. (2024) Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA). In: 47th International Spring Seminar on Electronics Technology (ISSE), 15th - 19th May 2024.